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USB 3.0

Bus runs at 4.8 Gbps.

See Also: USB, USB 2.0, microUsb, mini-USB


Showing results: 256 - 270 of 280 items found.

  • USB Oscilloscope

    Handyscope HS6 DIFF - TiePie engineering

    This powerful USB 3.0 super speed oscilloscope combines fast sampling up to 1 GS/s with high resolutions of 12, 14 and 16 bit and a large memory of 64 MSamples on all four channels. The oscilloscope supports continuous streaming measurements up to 200 MS/s and can be synchronized with other oscilloscopes using the CMI interface to form a multi channel combined instrument with synchronized timebase. The CMI interface is available by default on the Handyscope HS6 DIFF. Optionally, the Handyscope HS6 DIFF can be delivered with SureConnect connection test and resistance measurement on each channel. Also, the Handyscope HS6 DIFF can be delivered with SafeGround option. With SafeGround you can switch the differential inputs of the Handyscope HS6 DIFF into single ended inputs with ground protection. It allows to make measurements using standard attenuating probes and protects the scope when a short circuit to ground is created.

  • LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI

    ASMB-786 - Advantech Co. Ltd.

    - LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range

  • Fanless Ultra Compact Embedded System With Intel® Core™ I5-7300U &Intel® Celeron® 3965U Processor, DisplayPort++, 2 COM, 4 USB And 2 GbE LAN

    eBOX100-51R-FL - Axiomtek Co., Ltd.

    The eBOX100-51R-FL is a fanless ultra-compact embedded system with weight 600 grams only. As the smallest embedded system with Intel® Core™ ULT processor onboard, the eBOX100-51R-FL continues the design elements of eBOX100 series – ultra-slim form factor, rugged design, and rich I/O connectivity, allowing greater flexibility and a wider range of application in edge computing, IIoT gateway and extended fields. The eBOX100-51R-FL is powered by the high-performance Intel® Core™ i5-7300U or Intel® Celeron® 3965U processor. The front-facing I/O connectivity design provides convenient access for easy installation and maintenance. It comes with one DDR4-2133 SO-DIMM slot with system memory up to 16 GB. The eBOX100-51R-FL offers two RS-232/422/485, two USB 3.0 ports, two USB 2.0 ports, two Gigabit Ethernet ports, one DisplayPort++, one AT/ATX quick switch, and two SMA type antenna openings; moreover, the embedded system is equipped with one M.2 Key E 2230 slot for Wi-Fi, one M.2 Key B 2242 for SATA storage, and one screw-type 12VDC power input connector.

  • COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor

    CEM310 - Axiomtek Co., Ltd.

    The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).

  • Area Scan Cameras

    ace Series - Basler Vision Components AG

    Enjoy a new class of digital cameras that will help you to be even more successful and efficient at what you do. High quality and performance levels combined with a low starting list price of only 199 and a small 29 mm x 29 mm housing make Basler ace cameras one of the world''''s best-selling cameras with thousands of satisfied customers. It is available with several resolutions and speeds and with sensors from all leading manufacturers so that you can easily find the right ace camera model for your application. Choose from the most popular and standard proven data interfaces in the vision market: With the ace Gigabit Ethernet models, you benefit from our GigE market leadership, easy multi-camera setups and 100-meter cable length. Camera Link is the interface for high image data transfer. And with USB 3.0 there is an interface technology which is easy to use and real-time capable.

  • Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, HDMI/LVDS And LAN

    PICO312 - Axiomtek Co., Ltd.

    The PICO312 is a palm-sized fanless pico-ITX motherboard built with the latest 14 nm Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake SoC). One 204-pin DDR3L-1867 SO-DIMM socket supports system memory up to 8GB. The tiny 2.5” pico-ITX embedded board features Intel® Gen9 graphics engine bringing a true high definition visual experience with dual display configurations through one LVDS and HDMI. In addition, it was designed for special needs of fanless operation under temperature from -20°C to +70°C. The PICO312 features a full-sized PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors with additional signals including one PCIe x1 lane, one LPC, one DDI, four USB 3.0 ports, one SMBus and one HD audio, giving this SBC high expandability to meet all requirements.

  • 6U CompactPCI Intel® 4th/5th Gen. Core™ i5/i7 Processor Blade with ECC Support

    MIC-3396MIL - Advantech Co. Ltd.

    The MIC-3396MIL is specially design for ruggedized applications, and offers three different configurations that meet a wide range of environment requirements. Using 4th and 5th generation Intel® Core™ i5/i7 and Intel® Xeon® processors, it supports up to four cores / eight threads at 2.7GHz and 6MB last level cache. Ruggedized requirements are addressed by a conduction cooled design an extended operation temperature range (-40 ~ 85° C measured at wedge lock). Shock and vibration resistances of the board are increased by using wedge locks and a single-piece CNC-milled aluminum alloy plate that conforms to the major IC packages. With highly integrated functional capabilities, the MIC-3396MIL fully utilizes the I/O features of the Intel® chipsets. It supports maximum 16GB of 1600 MHz DDR3L RAM, an onboard 2.5" Serial ATA HDD or SSD, a CFast slot, for an onboard NAND flash (as optional), one PCIex16 and a set of I/O functions brought through the backplane to a unique rear transition module, which contains eight GPIOs, two USB 2.0 and four RS-232/422/485 console ports as pin headers, two SATA Gen III and two SATA Gen II as connectors, two/four LAN ports (two LAN ports are switchable form front panel to RTM), two DVI ports, two USB 3.0, one PCIex16, one P/S2 port and one RS-232/422/485 port on the front panel.

  • OpenVPX CPU Blade with 4th Generation Intel® Core™ Processor

    MIC-6311 - Advantech Co. Ltd.

    Advantech’s MIC-6311 is a single processor VPX blade based on the 4th generation Intel® Core™ i3/i5/i7 platform. It enables the highest performance available in 6U VPX form factor with two SRIOx4 ports in the VPX data plane and two PCI Express x8 gen. 3 lanes in the VPX expansion plane for workstation and compute intense applications. The two Serial RapidIO ports offer the possibility to interface the MIC-6311 to digital front ends such as DSP and FPGA cards via a high speed, low latency deterministic interconnect. In addition, PCI Express ports with up to 8GB/s throughput offer a high performance interface to mainstream peripherals and IO cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6311 offers the ability to fit harsh environments while maintaining maximum memory throughput and supporting memory expansion using the latest SO DIMM technology. Moreover, the 4th generation Intel® Core™ processors offer increased cache size and efficiency as well as instruction set improvements which make the MIC-6311 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for rugged environments, MIC-6311 has been designed to support ruggedized convection cooled heat sinks. Additionally, it implements an onboard soldered, industrial SSD for maximum reliability. By using the latest powerful PCH (Lynx Point) from Intel®, with its advanced SATA controller advanced storage options are supported such as a 2.5" SATA III HDD/SSD socket offering high storage capacity with up to 6Gbps transfer speed. A CFast socket provides an alternative for implementing a cost efficient, pluggable SSD. An onboard XMC/PMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports in front panel can connect to the external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS232 console (RJ45) and two GbE RJ45 ports, powered by Intel®’s latest Gigabit Ethernet Controiller, the i350. The processor’s integrated enhanced graphics engine Iris offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6311’s VGA front panel port and two Display port / HDMI interfaces on rear transition modules. Audio port support via the backplane interface enhances media support. Three SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to backplane to fulfill the demand for extra IO ports or storage. Two GbE/ SERDES ports support system level IP connectivity and two UART interfaces can be leveraged to interface to legacy devices and consoles.

  • ATEX & CID2 Anti-Explosion Certified Robust DIN-rail Fanless Embedded System With Intel® Atom® Processor E3827 (1.75 GHz)/E3845 (1.91 GHz)

    rBOX510-6COM (ATEX/C1D2) - Axiomtek Co., Ltd.

    The rBOX510-6COM(ATEX/C1D2) robust din-rail fanless embedded system is certified with ATEX and C1D2 for use in hazardous environments where ignitable concentrations of flammable gases, vapors or liquids might exist. The embedded system supports the dual-core Intel® Atom™ processor E3827 1.75GHz SoC with the onboard 4GB DDR3L system memory. The din-rail heavy-duty embedded PC adopts an IP30-rated aluminum and steel enclosure, and can perform in wide temperatures ranging from -40°C to +70°C. To prevent ESD and over-voltage, the compact embedded box PC is equipped with four isolated RS-232/422/485 ports, two isolated 10/100/1000Mbps Ethernet ports, and one isolated DIO (8-IN/8-OUT) port. One 2.5" SATA SSD, one mSATA and one CompactFlash™ socket are available for storage. More I/O features include one USB 3.0 port, one USB 2.0 port, two COM ports, and one VGA output. In addition, box PC comes equipped with a wide range 12 - 48VDC power input with a terminal block and has overvoltage and reverse protection. The box PC provides two watchdog timers and RTC battery function. Pre-installed with Linux, Windows® 8 Embedded and Windows® 7 Embedded, the embedded system provides programmers with a friendly environment for developing application software at a lower cost. For secure mounting, the rBOX510-6COM(ATEX/C1D2) can be easily installed on a DIN-rail mount or in an enclosure box.

  • 3.5” Embedded SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, LVDS, HDMI, 2 GbE LANs And Audio

    CAPA313 - Axiomtek Co., Ltd.

    The CAPA313 is powered by the Intel® Pentium® processor N4200 or Intel® Celeron® processor N3350 (codename: Apollo Lake). This 3.5" embedded board was designed for operational stability in harsh environments with a wide operating temperature range from -20°C to +70°C. It offers a wide range DC input of 12V to 24 for various industrial environments. It also comes with rich I/O connectors, stunning graphical performance and an emphasis on expandability. In addition to one 204-pin DDR3L-1867 SO-DIMM socket supporting system memory up to 8GB, the CAPA313 has one PCI Expess Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connection. The compact-size embedded board comes with one RS-232/422/485, one RS-232, two USB 2.0, four USB 3.0, eight-channel digital I/O, audio, LVDS, HDMI, VGA (optional) and dual Gigabit LANs with Intel® i211AT Ethernet controller. It also features one SATA-600 socket and one mSATA interface for storage devices. To ensure reliable operation, the 3.5” embedded SBC supports watchdog timer and hardware monitoring features.

  • OpenVPX CPU Blade with 4th/ 5th Generation Intel® Core™ Processor

    MIC-6313 - Advantech Co. Ltd.

    The MIC-6313 is Advantech’s next generation single processor 6U VPX blade, based on the 4th/ 5th Generation Intel® Core™ and Intel® Xeon® Processor E3 Lv4 embedded platform. To enable the highest performance available in the 6U VPX form factor for workstation and compute intense applications, the four Serial RapidIO ports in the VPX data plane offer high speed up to 5Gb/s, low latency, scalable, error recoverable deterministic interconnectivity to digital front ends such as DSP and FPGA cards. In addition, two PCI Express ports x8 lanes in the VPX expansion plane, with up to PCI Express gen. 2 (5Gb/s) throughput offer a high performance interface to mainstream peripherals and I/O cards. With a SO-DIMM socket and additional soldered, onboard DRAM with ECC in a dual channel design running up to 1600MT/s, the MIC-6313 can be integrated into various harsh environments while maintaining maximum memory throughput, and supports memory expansion by using the latest SO-DIMM technology simultaneously. In addition, the 4th/ 5th generation Intel® Core™ and Xeon® E3 Lv4 embedded processors offer increased cache size and efficiency, as well as instruction set improvements, which make the MIC-6313 a high performance compute engine with outstanding floating point and vector processing performance. Tailored for harsh environments, the MIC-6313 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternative optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial SSD is included for maximum reliability, and a CFast/ SSD socket is also available for a costefficient, modular storage. By using Intel®’s powerful PCH (Lynx Point) with its advanced SATA controller, the MIC-6313 offers high storage capacity at up to 6Gbps transfer speed. An onboard XMC site with PCIe x8 gen.3 connectivity can host high speed offload or I/O mezzanines. Two USB 3.0 ports on the front panel can connect to external devices with up to 5Gbps data rate. Network and remote connectivity can be achieved via a RS-232 console (RJ-45) and two GbE RJ-45 ports, powered by Intel®’s latest Gigabit Ethernet controller. The next generation graphics engine Intel® Iris Pro offers up to 2x the graphic performance compared to previous generation solutions. Triple independent display support can be implemented by using the MIC-6313’s DVI front panel port and two DVI interfaces on rear transition modules. Audio is powered by a ALC892 controller via the backplane interface, and provides media support. Four SATA ports (SATAIII) and four USB ports (2x USB 3.0, 2x USB 3.0) are also connected to the backplane to fulfill the demand for extra IO ports or storage. Four GbE ports (two SERDES selectable) support system level IP connectivity, and four UART interfaces (RS232/422/485 selectable) can be leveraged to interface to legacy devices and consoles.

  • Qseven Rev 2.1 Application Board With LVDS, HDMI, Dual LAN And Audio

    Q7B301 - Axiomtek Co., Ltd.

    The Q7B301 is an ultra-compact Qseven reference carrier board which measures only 100 x 72 mm - the size is slightly bigger than a credit card. The Q7B301 is perfect for small box applications such as those found in the latest digital signs, kiosks and traffic control system. This Qseven application board offers various I/O connectors and flexible expansion features to reduce the design effort to the minimum. The Q7B301 also has an extended industrial grade operating temperature range of -40ºC to +85ºC to withstand the rigors of harsh environments. Axiomtek’s new Qseven Rev. 2.1 application board, Q7B301, is compatible with Qseven module – Q7M311 which is powered by the Intel® Pentium® Processor N4200 and Celeron® Processor N3350. Customers can emulate required functions on Q7M301 as a reference design board or integrate the Q7M301 directly into their product as the application board. Its minimum footprint also enables the maximum potential. The Q7M301 is especially suited for industrial IoT applications such as industrial control, medical imaging, digital signage, gaming machines, military, and networking. The Q7B301 comes with two PCI Express Mini Card slots and one SIM card slot for wireless communication (3G/4G, GPS, Wi-Fi and Bluetooth). For enhanced or high-definition audiovisual devices, the Qseven reference carrier board supports one HDMI and LVDS interfaces as well as HD audio and 4-channel digital I/O. More I/O interfaces include two Gigabit LANs with Intel® i211AT Ethernet controller, two RS-232/422/485, one USB 2.0, two USB 3.0, one SMBus, and one I2C. Furthermore, it has one SATA-600 interface for storage requirements.

  • COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370

    CEM520 - Axiomtek Co., Ltd.

    The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.

  • 3.5” Embedded SBC With Intel® Pentium® N4200 & Celeron® Processor N3350, EDP, 2 HDMI, 2 GbE LANs And Audio

    CAPA315 - Axiomtek Co., Ltd.

    The CAPA315 is powered by the Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake). It comes with various I/O connectors and flexible expansion features within its 146 x 104 mm dimensions. The CAPA315 also has an extended operating temperature range of -20°C to 70°C to withstand the rigors of day-to-day operation. The 3.5-inch CAPA315 has one 204-pin DDR3L-1867 SO-DIMM for up to 8GB system memory. Furthermore, it comes with one RS-232/422/485, three RS-232, two USB 2.0, four USB 3.0, 8-channel digital I/O, HD Codec audio and dual Gigabit LANs with Intel® i211AT Ethernet controller. For storage requirements, it has one SATA-600 and one mSATA. Moreover, the low power embedded platform runs on +12VDC power, supporting auto power-on. For connectivity, this embedded board has a PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections. To ensure reliable operation across platforms, the 3.5-in embedded board also supports watchdog timer, hardware monitoring functions and Trusted Platform Module 1.2 (TPM 1.2).

  • Pico-ITX SBC With Intel® Pentium® Processor N4200/Celeron® Processor N3350, DisplayPort, LVDS, 2 GbE LAN And Audio

    PICO318 - Axiomtek Co., Ltd.

    The PICO318 is powered by the Intel® Pentium® processor N4200 or Celeron® processor N3350. The PICO318 is a low power-consumption 2.5-inch embedded board that is expandable, rugged design, feature-rich and versatile to help facilitate quick deployment. The PICO318 is equipped with one 204-pin DDR3L-1867 SO-DIMM for up to 8GB system memory. A dual-display capability is available through 18/24-bit single/dual channel LVDS and DisplayPort. For storage, there are one M.2 key B slot for SATA or PCIe x2 SSD card and one half-size PCI Express Mini Card slot with support for mSATA. Moreover, the pico-ITX form factor single board computer features 12V DC power supply input with AT Auto Power On function. The Intel® Apollo Lake-based pico-ITX board provides rich I/O connectivity including two USB 3.0 ports, two USB 2.0 ports, one RS-232/422/485 port, one RS-232 port, two Gigabit LAN ports with Intel® i211AT Ethernet controller, one HD Codec audio, and 4-channel digital I/O. The PICO318 is suitable for various industrial environments with an operating temperature range of -20°C to +60°C.

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